Brief: Discover the TIF050AB-11S, a two-component silicone thermally conductive gel material gap filler designed for electronics components. This high-performance solution enhances heat dissipation, ensuring efficiency and longevity for your electronic devices. Ideal for notebooks, set-top boxes, and more.
Related Product Features:
効率的な熱放散のために、4.0W/mKという優れた熱伝導率を実現しています。
UL recognized and compliant with safety standards.
Naturally tacky, eliminating the need for additional adhesive coatings.
Two-part formulation ensures easy storage and handling.
長持ちする性能のための高い耐久性。
容易な吐出のための最適化されたせん断減粘特性。
Suitable for a wide temperature range from -45°C to 200°C.
Available in custom packaging for automated dispensing applications.
FAQ:
What is the thermal conductivity of TIF050AB-11S?
The TIF050AB-11S offers excellent thermal conductivity of 4.0W/mK, ensuring efficient heat dissipation for electronic components.