Brief: Discover the Violet Customizable Thermal Pad, a high-performance silicon thermal pad designed for efficient heat dissipation in electronic components. The TIF500 Series offers excellent thermal conductivity, flexibility, and customization options for various applications.
Related Product Features:
効率的な熱伝達のために、2.6 W/mK の優れた熱伝導率があります。
Available in various thicknesses from 0.25mm to 5.0mm to suit different needs.
Broad range of hardness options for versatile applications.
Moldable for complex parts, ensuring a perfect fit.
優れた熱性能は、コンポーネントの寿命を延ばします。
高温環境での安全性のために,燃焼率94V0
Customizable with pressure-sensitive adhesive on one or both sides.
Reinforcement options include fiberglass for added durability.
FAQ:
TIF500シリーズ熱パッドの熱伝導性は?
TIF500シリーズのサーマルパッドは、熱伝導率2.6 W/mKで、効率的な熱伝達を保証します。
Can the thermal pad be customized with adhesive?
Yes, the thermal pad can be customized with pressure-sensitive adhesive on one side (A1 suffix) or both sides (A2 suffix).
What are the typical applications for this thermal pad?
Typical applications include RDRAM memory modules, automotive engine control units, telecommunication hardware, and handheld portable electronics.