Brief: Discover the TIF120-05S blue thermal pad, a high-performance solution for memory modules with 1.5W/MK thermal conductivity. Ideal for various applications, this UL94V0 certified pad ensures efficient heat dissipation and stability from -40℃ to 160℃.
Related Product Features:
効率的な放熱のための1.5W/mKの熱伝導率。
Available in thicknesses from 0.5mm to 5.0mm for versatile applications.
UL94V0 certified for safety and reliability.
Low oil permeability and high softness for easy handling.
-40°Cから160°Cの温度で安定した性能
高い粘着性の表面が接触抵抗を低減し、より優れた熱伝達を実現します。
Soft and compressible, ideal for low-stress applications.
Easy release construction for convenient installation.
FAQ:
What is the thermal conductivity of the TIF120-05S thermal pad?
The TIF120-05S thermal pad has a thermal conductivity of 1.5W/mK, ensuring efficient heat dissipation for memory modules and other applications.