Brief: Discover the TIF100-01US Series, a high-quality heat insulation silicone CPU thermal pad with various thickness options. Perfect for CPUs, display cards, and more, this thermal pad offers outstanding thermal performance, moldability, and softness for low-stress applications. Learn about its features and applications in this video.
Related Product Features:
Outstanding thermal performance with 1.5 W/mK thermal conductivity.
複雑な部品に対応し、最適なフィット感と性能を保証します。
Soft and compressible, ideal for low-stress applications.
Naturally tacky, eliminating the need for additional adhesive coating.
幅広い温度範囲(-40℃~160℃)で安定した性能を発揮します。
Compliant with UL94V0 flame rating for safety.
Available in various thicknesses from 0.25mm to 5.0mm.
Can be reinforced with fiberglass for added durability.
FAQ:
What is the thermal conductivity of the TIF100-01US Series thermal pad?
The TIF100-01US Series thermal pad has a thermal conductivity of 1.5 W/mK, ensuring efficient heat dissipation.
What temperature range can the TIF100-01US Series thermal pad withstand?
This thermal pad can operate stably in temperatures ranging from -40℃ to 160℃, making it suitable for various applications.
Are there adhesive options available for the TIF100-01US Series thermal pad?
Yes, you can request adhesive on one side (A1 suffix) or both sides (A2 suffix) for easy installation.