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| 起源の場所: | 中国 |
| ブランド名: | Ziitek |
| 証明: | UL & RoHS |
| モデル番号: | TIF700Res |
| 最小注文数量: | 1000pcs |
|---|---|
| 価格: | 0.1-10 USD/PCS |
| パッケージの詳細: | 24*13*12cmカートン |
| 受渡し時間: | 3-5営業日 |
| 支払条件: | T/T |
| 供給の能力: | 10000 PCS/月 |
| 製品名: | 高温8.5WカスタムシリコーンギャップフィラーGPU CPU LED用の電気サーマルパッド | 応用: | GPU CPU LED |
|---|---|---|---|
| 厚さ: | 0.04〜0.12inch / 1.0〜3.0mm | 比重: | 3.5g/cc |
| 誘電性破壊電圧: | > 5000 VAC | 熱伝導率: | 8.5W/mk |
| 色: | グレー | 動作温度: | -40〜200℃ |
| キーワード: | シリコンサーマルパッド | ||
| ハイライト: | 8.5W/mK silicone thermal pad,GPU CPU thermal pad with warranty,high-performance thermal pad for LED |
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High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads For Gpu Cpu Led
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Product introduction
TIF®700RES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Excellent thermal conductivity: 8.5 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
> Easy release construction
> Electrically isolating
Applications
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
> Display card
> Mainboard/mother board
> Notebook
> Power supply
| Typical Properties of TIF®700RES Series | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | *** |
| Thickness range | 0.04~0.12inch / 1.0~3.0mm | ASTM D374 |
| Hardness | 10 Shore 00 | ASTM 2240 |
| Specific Gravity | 3.5 g/cc | ASTM D792 |
| Continuos Use Temp | -40 to 200℃ | Ziitek Test Method |
| Dielectric Breakdown Voltage | ≥5000 VAC | ASTM D149 |
| Dielectric Constant | 6.7 MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X1012Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 8.5W/m-K | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
コンタクトパーソン: Dana Dai
電話番号: +86 18153789196
