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Green 1.8W/mK Thermal Gap Filler For Unmanned Aerial Vehicle UAV

Green 1.8W/mK Thermal Gap Filler For Unmanned Aerial Vehicle UAV

商品の詳細:
起源の場所: 中国
ブランド名: Ziitek
証明: UL & RoHS
モデル番号: TIF100-18-56U
書類: TIF100-18-56U_Data Sheet.pdf
お支払配送条件:
最小注文数量: 1000個
価格: 0.1-10 USD/PCS
パッケージの詳細: 24*13*12カートン
受渡し時間: 3~5営業日
支払条件: T/T
供給の能力: 10000 PCS/月
連絡先
詳細製品概要
製品名: 無人航空機 Uav 用の緑色の 1.8W/mK サーマル ギャップ フィラー 硬度: 65/27 ショア00
熱伝導率: 1.8W/m-K サンプル: サンプル無料
厚さ: 0.010インチ(0.25)~0.200インチ(5.0mm) 比重: 2.2g/cm3
応用: 電気自動車のバッテリー 絶縁破壊電圧: 5000以上のVAC
色: キーワード: サーマルギャップフィラー

Green 1.8W/mK Thermal Gap Filler For Unmanned Aerial Vehicle Uav


Products description


The TIF®100-18-56U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.


Features


> Good thermal conductive: 1.8W/mK
> Ultra-soft and highly conformable
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance

> RoHS compliant
> UL recognized


Applications


> Auditioning electronic products
> unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Server


Typical Properties of TIF®100-18-56U Series
Property Value Test method
Color Green Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.8 W/m-K ASTM D5470
1.8 W/m-K ISO22007


Products specification


Standard Thickness: 0.010"(0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm X406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.For other
thicknesses or more information, please contact us.


Green 1.8W/mK Thermal Gap Filler For Unmanned Aerial Vehicle UAV 0

 

Company profile


Ziitek Technology CO.,Ltd is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Why Choose us ? 

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

連絡先の詳細
Dongguan Ziitek Electronical Material and Technology Ltd.

コンタクトパーソン: Dana Dai

電話番号: +86 18153789196

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