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High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications

  • High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications
  • High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications
High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications
商品の詳細:
起源の場所: 中国
ブランド名: Ziitek
証明: UL
モデル番号: TIF050-11-1
お支払配送条件:
最小注文数量: 1000チューブ
価格: 0.1-100USD/KG
パッケージの詳細: 300cc/PCS,6PCS/箱
受渡し時間: 3-8勤務日
支払条件: T/T
供給の能力: 10000KG/Month
連絡先
詳細製品概要
製品名: 高伝導性熱伝導性ゲル 5.0W/MK 絶縁性熱伝導性ゲル PCB アプリケーションに適しています 比重: 3.25g/cc
色: 濃い灰色 マテール: セラミックで満たされたシリコン材料
耐電圧 (V/mm): ≥6000 熱伝導率: 5.0W/m-k
キーワード: 熱ジェル アプリケーション: PCB アプリケーション
変電気変数 @1MHz: 7.7

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications

 

TIF®050-11-1 is a thermally conductive paste with excellent interface thermal resistance characteristics and outstanding plasticity, capable of fully meeting the strict thermal management performance requirements of various designs; this material has extremely low hardness, possesses free-forming ability, and is easy to construct and assemble, demonstrating good stability in high-temperature environments. Its low-stress characteristics are particularly suitable for electronic devices that require high precision and high reliability, effectively reducing the mechanical stress on sensitive components during assembly and operation, ensuring the long-term stable operation of products in various application  environments.

 

Feature

 

> Thermal conductivity: 5.0 W/mK
> Low stress, protect sensitive components.
> Strong plasticity. good stability
> Superior dielectric properties

 

Application

 

> Power module
> LED backlight module, LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment

 

TIF®050-11-1 Typical Properties
Property Value Test method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicon material ******
Density(g/cm³) 3.25g/c ASTM D792
Thermal conductivity 5.0W/mK ASTM D5470
Breakdown Voltage (V/mm) ≥6000 ASTM D149
Dielectric constant @1MHz 7.7 ADTM D150
Flame Rating V-0 UL 94
Volume resistivity(Ohm.cm) 8.0 X 1013 ASTM D257

 

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications 0

Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

連絡先の詳細
Dongguan Ziitek Electronical Material and Technology Ltd.

コンタクトパーソン: Dana Dai

電話番号: +86 18153789196

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