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| 起源の場所: | 中国 |
| ブランド名: | Ziitek |
| 証明: | UL & RoHS |
| モデル番号: | TIF500-30-11US |
| 最小注文数量: | 1000個 |
|---|---|
| 価格: | 0.1-10 USD/PCS |
| パッケージの詳細: | 24*13*12cmカートン |
| 受渡し時間: | 3～5営業日 |
| 支払条件: | T/T |
| 供給の能力: | 10000 PCS/月 |
| 製品名: | CPU GPU AI およびプロセッサー向けの優れた導電性と絶縁性を備えた高性能 3.0W/MK シリコン サーマル パッド | 厚さの範囲: | 0.25~5.0mm /(0.010~0.20インチ) |
|---|---|---|---|
| 硬度: | 20海岸00 | 密度: | 3.1 g/cm3 |
| 熱伝導率: | 3.0W/m-K | 色: | 濃い灰色 |
| キーワード: | シリコーンの熱パッド | 応用: | CPU GPU AI とプロセッサー |
High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors
Products Description
TIF®500-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Features:
> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> RoHS compliant
> UL recognized
Applications:
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> Display card
> Mainboard/mother board
> Notebook
| Typical Properties of TIF®500-30-11US Series | |||
| Property | Value | Test method | |
| Color | Dark gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.5) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 6.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 3.0 W/m-K | ASTM D5470 | |
| 3.0 W/m-K | ISO22007 | ||
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q:Is there promotion price for big buyer?
A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
コンタクトパーソン: Dana Dai
電話番号: +86 18153789196
