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Ultra-Soft 10W/mK Thermal Pad with Ceramic Filled Silicone for High-End Chip Cooling

Ultra-Soft 10W/mK Thermal Pad with Ceramic Filled Silicone for High-End Chip Cooling

商品の詳細:
起源の場所: 中国
ブランド名: Ziitek
証明: UL and RoHs
モデル番号: TIF100 10020-11
書類: TIF100 10020-11_Data Sheet.pdf
お支払配送条件:
最小注文数量: 1000個
価格: 0.1-10 USD/PCS
パッケージの詳細: 24*13*12 センチメートルカートン
受渡し時間: 3~8営業日
支払条件: T/T
供給の能力: 100000個/月
連絡先
詳細製品概要
製品名: 超高性能 10W/mK サーマル パッド ハイエンド チップのギャップ パッドを効果的に埋める 熱伝導性: 10.0W/mK
硬度: 20海岸00 サンプル: 無料サンプル
色: ダークグレー 厚さ: 0.012"〜0.200"/(0.30〜5.0mm)
密度: 3.3g/cm3 キーワード: シリコンサーマルパッド
工事: セラミック充填シリコーンエラストマー 応用: ハイエンドチップ

Ultra Performance 10W/mK Thermal Pad Effectively Fill Gaps Pad For High-end Chip
Product Description
The TIF®100 10020-11 Series is an ultra-soft thermal interface material specifically designed to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-like softness, achieving a low-stress perfect fit. It effectively addresses issues in high-precision assemblies, including large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.
Features
  • Excellent thermal conductivity 10.0W/mK
  • Super soft and highly compliant
  • Self-adhesive without the need for additional surface adhesives
  • High insulation performance
Applications
  • AI Servers
  • Semiconductor Packaging
  • Low-Altitude Aircraft
  • Optical Communication Products
  • 5G Base Stations
Typical Properties of TIF®100 10020-11 Series
Property Value Test Method
Color Dark White Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.3 ASTM D792
Thickness Range (inch/mm) 0.012~0.020 | 0.030~0.200
0.30~0.50 | 0.75~5.0
ASTM D374
Hardness (Shroe 00) 20 | 20 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 6.4 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 10.0W/m-K
10.0 W/m-K
ASTM D5470
ISO22007
Product Specifications
Standard Thickness: 0.012" (0.30 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"x16" (406 mm x 406 mm)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
TIF Series Thermal Pad Product Image
Packaging Details & Lead Time
Packaging of Thermal Pad:
  • With PET film or foam for protection
  • Use paper card to separate each layer
  • Export carton inside and outside
  • Meet with customers' requirement - customized
Lead Time:
Quantity (Pieces): 5000
Est. Time (days): To be negotiated
Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies
Company Profile
Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste, thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel, silicone foam, silicone-free thermal pads etc. We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.
Ziitek Culture
Quality: Do it right the first time, total quality control
Effectiveness: Work precisely and thoroughly for effectiveness
Service: Quick response, on time delivery and excellent service
Team Work: Complete teamwork, including sales team, marketing team, engineering team, R&D team, manufacturing team, logistics team. All is for supporting and servicing a satisfying service for customers.
Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies

連絡先の詳細
Dongguan Ziitek Electronical Material and Technology Ltd.

コンタクトパーソン: Dana Dai

電話番号: +86 18153789196

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