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2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications

2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications

商品の詳細:
起源の場所: 中国
ブランド名: Ziitek
証明: UL
モデル番号: TIF100-20-02U
書類: TIF100-20-02U_Data Sheet.pdf
お支払配送条件:
最小注文数量: 1000個
価格: 0.1-10 USD/PCS
パッケージの詳細: 24*13*12 センチメートルカートン
受渡し時間: 3~8営業日
支払条件: T/T
供給の能力: 100000個/月
連絡先
詳細製品概要
製品名: AI プロセッサーおよびサーバー アプリケーションの熱放散用の高熱伝導率シリコーン サーマル パッド 2.0W/mK 硬度: 65/27 ショア00
キーワード: シリコンサーマルパッド 色: 灰色白
熱伝導率: 2.0W/mk 応用: AIプロセッサおよびサーバーアプリケーションの熱放散用
工事: セラミック充填シリコーンエラストマー 厚さ: 0.010~0.200インチ(0.25~5.0mm)
サンプル: 無料

2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications
Product Overview

TIF®100-20-02U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.

Key Features
  • Good thermal conductivity
  • Ultra-soft and highly conformable
  • Self-adhesive without the need for additional surface adhesive
  • Good insulation performance
Applications
  • Home appliance industry
  • Power module
  • Wearable devices
  • Solar photovoltaic panels
  • LED lighting fixtures
  • Routers
  • Medical devices
  • Audio electronic products
  • Unmanned aerial vehicles (UAV)
  • Photovoltaic systems
  • Signal communication
  • New energy vehicles
  • Motherboard chip
  • Radiator
  • AI Processors AI Servers
Technical Specifications of TIF®100-20-02U Series
Property Value Test Method
Color Gray white Visual
Construction Ceramic filled silicone elastomer ******
Density (g/cm³) 2.7 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 (0.25~0.50)
0.030~0.200 (0.75~5.00)
ASTM D374
Hardness (Shore 00) 65 | 27 ASTM 2240
Continuous Use Temp -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.5 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 2.0 ASTM D5470
ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications 0


Company Advantages
  • Our value message is "Do it right the First time, total quality control"
  • Our core competency is thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and Business Secret Contract
  • Free sample offer
  • Quality assurance contract
Frequently Asked Questions
Q: Do you accept custom orders?
A: Yes, we welcome custom orders. Our customization options include dimensions, shape, color, and coating on one or both sides with adhesive or fiberglass. To place a custom order, please provide a drawing or detailed specifications.
Q: How do I request customized samples?
A: To request samples, you can leave us a message on our website, or contact us via email or phone.
Q: What's the thermal conductivity test method given on the data sheet?
A: All data in the sheet are actual tested results. Hot Disk and ASTM D5470 methods are utilized to test thermal conductivity.

連絡先の詳細
Dongguan Ziitek Electronical Material and Technology Ltd.

コンタクトパーソン: Dana Dai

電話番号: +86 18153789196

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